R&D Engineer: Test Engineering Wafer Test, Final Module Test & Characterization

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Job Description:

Development of device testing at wafer level, die level and module level

More specific duties include the following:

• Definition of test requirements and test methods for our optoelectronic transceiver and sensor products as well as for our in-house mixed signal ASICs and sensor chips, which are used within these products.
• Development, bring up and debugging test hardware and software for evaluation, device characterization (bench) and production testing. This can be either completely in-house or in cooperation with external engineering partners.
• Design of test application PCBs, test sockets, probe cards.
• Handover of test solutions to the production site or to external test houses.
• Full characterization of the devices over corner conditions, according to specification.
• Evaluation, analysis and reporting of characterization results and production test results along with creation of respective reports.
• Close cooperation with IC-designers, product-designers and project leaders throughout the entire project phase.
• Optimization of productive test packages (wafer level or final module test) based on the analysis of characterization and test data in order to achieve cost-efficient test solutions.

Required qualifications:

• Master’s Degree or PhD in Electrical Engineering, Physics or equivalent discipline with focus on semiconductor devices and/or electrical/optical testing and measurement technology.
• 3+ years of experience in semiconductor testing.

Desired skills and expertise:

• Deep technical expertise in the area of testing and measurement technology as well as data analysis techniques.
• Experience with discrete test/measurement equipment (oscilloscope, SMU, spectrum analyzer, etc.). Ideally also familiar with ATE equipment from well-known manufacturers (e.g. Teradyne, Advantest, LTX, etc.).
• Good knowledge of wafer probers and different probe card technologies.
• Profound expertise of structured programming using common languages, e.g. Python, C++, LabVIEW, NI TestStand, Python, C#, Java, MATLAB or similar software and maybe special ATE programming languages.
• Experience using AI tools to support the execution of the tasks described above.
• Good technical background in semiconductors.
• Both a self-contained, accurate approach to work and a broad interest in interdisciplinary work at the interface of electronics, optics, fiber technology and communication systems.
• Project experience and ability to integrate into teams across different functions and locations.

General Requirements:

• Spoken and written proficiency in English. Prepared to learn German and acquire German communication skills.
• Openness to new technical fields and a motivation to familiarize oneself with them.
• Interface to customers as well as to suppliers, travel requirement up to 20% of the time, depending on project requirements. Need to be a good team player.

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