Lead Expert – Hybrid Bonding, CMP & Advanced Packaging Metrology
# Lead Expert – Hybrid Bonding, CMP & Advanced Packaging Metrology **Nearfield Instruments** · China; Germany; Japan; South Korea; Taiwan; United States · `Remote` · `Contractor` 💼 **Уровень роли:** `Senior` 🕒 **Статус:** *Опубликовано: сегодня* · *Источник: Himalayas (JSON API)* --- ### Top Skills & Match 🎯 **Ключевой стек роли:** `[Semiconductor-Engineering]` `[Metrology]` `[Process-Engineering]` `[Advanced-Packaging-Engineering]` `[Technology-Leadership]` `[Senior-Packaging-Engineer]` `[Metrology-Specialist]` `[Packaging-Integration-Engineer]` `[Packaging-Engineering-Manager]` --- ### About the Role About Nearfield Instruments Nearfield Instruments (NFI) is a fast-growing, high-tech scale-up. We design, develop, integrate, market, and service advanced metrology machines. Our solutions enable the world’s leading chipmakers to increase production yield and improve device performance—powering smaller, faster, and more energy-efficient electronics. Nearfield brings together leading experts in science and engineering to develop a unique, high-throughput Scanning Probe Microscopy (SPM) platform delivering true 3D, sub-nanometer resolution metrology at production scale. We are looking for a senior semiconductor expert with deep experience in hybrid bonding, chemical mechanical planarization (CMP), and advanced packaging , gained within a leading-edge fab, research institute, or semiconductor equipment company. This expert will lead Nearfield Instruments ’ application and technology direction for CMP, hybrid bonding, wafer-to-wafer and die-to-wafer integration, and advanced packaging. The role will identify the most critical process-control challenges, translate them into clear metrology requirements, and drive the development of new applications, capabilities, and product features that create greater value for customers. Key responsibilities include: - Lead the identification of unmet metrology needs and critical process-control gaps in CMP, hybrid bonding, and advanced packaging. - Define the most valuable measurements, specifications, and use cases, including topography, dishing, erosion, surface roughness, edge roll-off, wafer shape, bonding interfaces, and full-die uniformity. - Set application priorities and translate customer and manufacturing needs into product and technology roadmaps. - Lead engagement with customers, process engineers, and equipment partners to validate requirements and accelerate adoption. - Drive the development of metrology solutions that improve yield, process stability, qualification time, and manufacturing performance. - Guide R&D and product teams on measurement performance, workflow integration, sampling strategies, and high-volume manufacturing requirements. The ideal candidate has: - Significant experience in semiconductor process integration, CMP, hybrid bonding, or advanced packaging. - Strong understanding of metrology, inspection, and process control in high-volume manufacturing. - Experience working with leading semiconductor fabs, equipment suppliers, or advanced R&D organizations. - A proven ability to lead cross-functional teams and convert complex process challenges into differentiated products and applications Originally posted on Himalayas
- Semiconductor-Engineering
- Metrology
- Process-Engineering
- Advanced-Packaging-Engineering
- Technology-Leadership
- Senior-Packaging-Engineer
- Metrology-Specialist
- Packaging-Integration-Engineer
- Packaging-Engineering-Manager
Наблюдалась 2026-10-15, впервые 2026-10-15, источник — Himalayas (JSON API).