IC Packaging Design Engineer, Amazon Leo
# IC Packaging Design Engineer, Amazon Leo **Amazon Kuiper Manufacturing Enterprises LLC** · San Diego, California, USA · `On-site` · `full-time` 🕒 **Статус:** *Опубликовано: 8 дней назад* · *Источник: Amazon* --- ### Top Skills & Match 🎯 **Ключевой стек роли:** `[Hardware Development]` `[ASIC]` --- ### About the Role Amazon Leo is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world. Come work at Amazon! The Role As an IC Packaging Design Engineer, you will engage with an experienced cross-disciplinary staff to conceive and design innovative product solutions. You will work closely with an internal inter-disciplinary team, and third-party suppliers to drive key aspects of product definition, execution and optimization. You must be responsive, flexible and able to succeed within an open collaborative peer environment. As a member of the packaging team, you will be responsible for package design for mm-wave beamforming SoCs and front-end modules. Strong focus will be on creating the most power optimized solution for a given system performance. Export Control Requirement Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum. Key job responsibilities In this role you will: • Collaborate with digital design, and RF chip designers define floorplans, bump maps, and ball maps for beamforming ICs. • Work with package vendors on stack-ups, materials selection, package options, and thermal testing/design. • Analyze cost/performance trade-offs, and complete layout of package types such as FCBGA, FCCSP, WLCSP, QFN, etc. • Setup and run 3D electromagnetic simulations of package + PCB in tools such as HFSS and Momentum to verify your designs. • Perform signal integrity checks and create models for packages to identify issues like crosstalk and coupling. • Assist the thermal team in defining and running thermal simulations of packages and PCBs. • Collaborate with the Antenna and EE teams to design and layout test and application PCBs for your packages. • Advise on qualification of packages: HAST, HTOL, board level reliability, etc. • Define and implement AI-driven workflows for packaging design, leveraging automation and machine learning to accelerate design iterations and optimize performance. - Bachelor's degree in Electrical Engineering or a related field - 5+ years of experience in RF design, preferably in an advanced node - Proven track record where products have gone to volume production - Experience with RF communication systems
- Hardware Development
- ASIC
- Aerospace HW Dev Engineer
Наблюдалась 2026-09-15, впервые 2026-09-08, найдена на 2 площадках, источник — Amazon.