Advanced Package Development Engineer

Join the team behind the technology in a billion pockets worldwide. Apple's Advanced Packaging Program is seeking engineers to drive package integration and technology development for next-generation products. In this role, you'll contribute to the advanced packaging technologies that enable Apple's industry-leading silicon performance. You'll work alongside world-class engineers to solve complex integration challenges and bring new packaging innovations from concept to mass production.

• You will be responsible for advanced packaging development and pathfinding.
• Drive engagement with leading-edge foundries/OSATs to lead package integration, process definition, and architecture efforts.
• Define specs, drive process windows, and establish advanced packaging solutions (2.5D/3D, hybrid bonding, high-density wafer-level interconnects).

Collaborate with cross-functional domains through the package architecture and definition process to deliver optimized solutions meeting electrical, mechanical, and thermal requirements. Drive process definition, baseline flow development, and margin validation in close collaboration with foundry/OSAT partners. Lead test vehicle (TV) definition, floorplanning, tapeout execution, and DOE build plans with foundries through development and NPI phases. Perform layout and GDS/mask review (GDSII/OASIS), ensuring DRC/LVS compliance and design-for-manufacturing (DFM) alignment with foundry design rules. Lead comprehensive data collection, statistical data analysis, and yield tracking across wafer-level process steps to drive yield enhancement and process centering. Drive failure analysis (FA), root-cause investigations, and issue resolution for wafer-level process excursions, defectivity, and reliability marginalities. Apply advanced data analytics and AI/ML techniques to convert complex foundry inline/metrology datasets into actionable process optimization insights.

BS and 10+ years of experience in relevant industry experience.

MS/PhD and 6+ years of relevant industry experience in advanced wafer-level packaging. Deep technical expertise in advanced packaging architectures and foundry processes Hands-on experience reviewing GDS/layout data, physical verification (DRC/LVS), and working with IC layout/viewing tools (e.g., Calibre, Virtuoso, KLayout). Proven track record managing foundry partners, defining DOEs, driving NPI engineering builds, and analyzing inline/end-of-line metrology and electrical test data. Solid background in packaging physics, multi-domain interactions (thermo-mechanical, warpage, thin-wafer handling, reliability, and SI/PI fundamentals). Strong problem-solving, analytical rigor, and communication skills to interface effectively with cross-functional and overseas foundry/OSAT partners.